| Processor Support |
VIA® C7 1GHz / 21x21mm nano BGA2 package
- TDP max 1.2GHz @12W
- Supports VRM mobile (down to 0.7V)
- Thermal design margin up to 100°c Tcase
- 3D instructions SSE / SSE2 / SSE3
- Security Features RGN / AES / SHA-1 |
| Supported FSB |
. 400/533 MHz |
| Chipset |
. North Bridge: VIA® CN700
. South Bridge: VIA® VT8237R+ chipset |
| Memory |
. DDRII DDRII 400 / 533 SDRAM (2GB Max)
. 1 DDRII DIMMs (240pin / 1.8V) |
| Audio |
. Chip integrated by VIA® VT1618
. Flexible 5.1-channel audio with jack sensing
. Compliant with AC97 2.3 spec |
| LAN |
. Supports PCI LAN 10/100 Fast Ethernet by VIA® VT6103L |
| IDE |
. One IDE port by VT8237R+
. Supports Ultra DMA 66/100/133 mode
. Supports PIO, Bus Master operation mode |
| SATA |
. Supports two SATA ports by VT8237R+
. Supports storage and data transfers at up to 150MB/s |
| RAID |
. SATA1-2 supports RAID 0/ 1 or JBOD mode by VT8237R+ |
| Connectors |
. Back Panel
- 1 PS/2 mouse port
- 1 PS/2 keyboard port
- 2 serial ports (COA and COMB)
- 2 USB 2.0 ports
- 1 LAN jack
- 3 flexible audio jacks
- 1 Graphics Card port |
. On-Board Pinheaders
- 3 USB 2.0 pinheaders
- 1 audio pinheader |
| Slots |
. 1 PCI slot
. Supports 3.3V/ 5V PCI bus Interface |
| Form Factor |
. Mini-ITX 170mm x 170mm |
| Mounting |
. 4 mounting holes |
| |
